MX1N4751AP vs 1N4751A feature comparison

MX1N4751AP Microsemi Corporation

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1N4751A Motorola Mobility LLC

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MOTOROLA INC
Part Package Code DO-41 DO-41
Package Description O-PALF-W2 O-LALF-W2
Pin Count 2 2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AL DO-41
JESD-30 Code O-PALF-W2 O-LALF-W2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 150 °C 200 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material PLASTIC/EPOXY GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1 W
Reference Standard MIL-19500
Reference Voltage-Nom 30 V 30 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 8.5 mA 8.5 mA
Base Number Matches 4 15
Manufacturer Package Code CASE 59-03
Additional Feature METALLURGICALLY BONDED
Knee Impedance-Max 1000 Ω
Qualification Status Not Qualified
Reverse Current-Max 5 µA

Compare MX1N4751AP with alternatives

Compare 1N4751A with alternatives