MX1N3824AUR-1TR
vs
MQ1N3824AUR-1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Part Package Code
DO-213AB
DO-213AB
Package Description
O-LELF-R2
HERMETIC SEALED, LEADLESS, GLASS, MELF-2
Pin Count
2
2
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
TR, 7 INCH: 1500
METALLURGICALLY BONDED, HIGH RELIABILITY
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-213AB
DO-213AB
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1.25 W
1.25 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
4.3 V
4.3 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Tol-Max
5%
5%
Working Test Current
58 mA
58 mA
Base Number Matches
1
1
Moisture Sensitivity Level
1
Compare MX1N3824AUR-1TR with alternatives
Compare MQ1N3824AUR-1 with alternatives