MX1N3042BUR-1 vs JANHCA1N3042D feature comparison

MX1N3042BUR-1 Microsemi Corporation

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JANHCA1N3042D Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DO-213AB DIE
Package Description O-LELF-R2 S-XXUC-N2
Pin Count 2 2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED, HIGH RELIABILITY
Case Connection ISOLATED CATHODE
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-213AB
JESD-30 Code O-LELF-R2 S-XXUC-N2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS UNSPECIFIED
Package Shape ROUND SQUARE
Package Style LONG FORM UNCASED CHIP
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1.25 W 1 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 82 V 82 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WRAP AROUND NO LEAD
Terminal Position END UNSPECIFIED
Voltage Tol-Max 5% 1%
Working Test Current 3 mA 3 mA
Base Number Matches 4 1
Pbfree Code No
Reference Standard MIL-19500/115K

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