MX1N3039BUR-1 vs MQ1N4759DGE3 feature comparison

MX1N3039BUR-1 Microsemi Corporation

Buy Now Datasheet

MQ1N4759DGE3 Microsemi Corporation

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DO-213AB DO-204
Package Description O-LELF-R2 O-LALF-W2
Pin Count 2 2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED, HIGH RELIABILITY
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-213AB DO-204AL
JESD-30 Code O-LELF-R2 O-LALF-W2
JESD-609 Code e0 e3
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1.25 W 1 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 62 V 62 V
Surface Mount YES NO
Technology ZENER ZENER
Terminal Finish TIN LEAD MATTE TIN
Terminal Form WRAP AROUND WIRE
Terminal Position END AXIAL
Voltage Tol-Max 5% 1%
Working Test Current 4 mA 4 mA
Base Number Matches 4 2
Moisture Sensitivity Level 1

Compare MX1N3039BUR-1 with alternatives

Compare MQ1N4759DGE3 with alternatives