MV1N973C-1E3TR vs MSP1N973C feature comparison

MV1N973C-1E3TR Microsemi Corporation

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MSP1N973C Microsemi Corporation

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DO-7 DO-7
Package Description O-LALF-W2
Pin Count 2 2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED
Configuration SINGLE
Diode Element Material SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AA
JESD-30 Code O-LALF-W2
JESD-609 Code e3 e0
Number of Elements 1
Number of Terminals 2
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS
Package Shape ROUND
Package Style LONG FORM
Polarity UNIDIRECTIONAL
Power Dissipation-Max 0.417 W
Qualification Status Not Qualified
Reference Voltage-Nom 33 V
Surface Mount NO
Technology ZENER
Terminal Finish MATTE TIN TIN LEAD
Terminal Form WIRE
Terminal Position AXIAL
Voltage Tol-Max 2%
Working Test Current 3.8 mA
Base Number Matches 1 8
Pbfree Code No

Compare MV1N973C-1E3TR with alternatives

Compare MSP1N973C with alternatives