MV1N5956AG
vs
1N5956AP
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
Package Description |
O-LALF-W2
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Case Connection |
ISOLATED
|
|
Configuration |
SINGLE
|
|
Diode Element Material |
SILICON
|
|
Diode Type |
ZENER DIODE
|
|
JEDEC-95 Code |
DO-204AL
|
|
JESD-30 Code |
O-LALF-W2
|
|
JESD-609 Code |
e0
|
|
Number of Elements |
1
|
|
Number of Terminals |
2
|
|
Operating Temperature-Max |
175 °C
|
|
Operating Temperature-Min |
-65 °C
|
|
Package Body Material |
GLASS
|
|
Package Shape |
ROUND
|
|
Package Style |
LONG FORM
|
|
Polarity |
UNIDIRECTIONAL
|
|
Power Dissipation-Max |
1.5 W
|
|
Qualification Status |
Not Qualified
|
|
Reference Standard |
MIL-19500
|
|
Reference Voltage-Nom |
200 V
|
|
Surface Mount |
NO
|
|
Technology |
ZENER
|
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
WIRE
|
|
Terminal Position |
AXIAL
|
|
Voltage Tol-Max |
10%
|
|
Working Test Current |
1.9 mA
|
|
Base Number Matches |
1
|
4
|
|
|
|
Compare MV1N5956AG with alternatives
Compare 1N5956AP with alternatives