MV1N5242B-1TR vs 1N5242B-1 feature comparison

MV1N5242B-1TR Microsemi Corporation

Buy Now Datasheet

1N5242B-1 Microchip Technology Inc

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Part Package Code DO-35
Package Description O-LALF-W2 HERMETIC SEALED, GLASS, DO-35, 2 PIN
Pin Count 2
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AH DO-204AH
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e0 e0
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.48 W 0.48 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 12 V 12 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 20 mA 20 mA
Base Number Matches 1 3
Factory Lead Time 14 Weeks
Samacsys Manufacturer Microchip
Additional Feature METALLURGICALLY BONDED
Dynamic Impedance-Max 30 Ω

Compare MV1N5242B-1TR with alternatives

Compare 1N5242B-1 with alternatives