MV1N5226CUR-1 vs MSP1N5226CUR-1TR feature comparison

MV1N5226CUR-1 Microsemi Corporation

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MSP1N5226CUR-1TR Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Diode Type ZENER DIODE ZENER DIODE
JESD-609 Code e0 e0
Terminal Finish TIN LEAD TIN LEAD
Base Number Matches 1 1
Part Package Code DO-213AA
Package Description O-LELF-R2
Pin Count 2
Case Connection ISOLATED
Configuration SINGLE
Diode Element Material SILICON
JEDEC-95 Code DO-213AA
JESD-30 Code O-LELF-R2
Moisture Sensitivity Level 1
Number of Elements 1
Number of Terminals 2
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS
Package Shape ROUND
Package Style LONG FORM
Polarity UNIDIRECTIONAL
Power Dissipation-Max 0.5 W
Qualification Status Not Qualified
Reference Standard MIL-19500
Reference Voltage-Nom 3.3 V
Surface Mount YES
Technology ZENER
Terminal Form WRAP AROUND
Terminal Position END
Voltage Tol-Max 2%
Working Test Current 20 mA

Compare MV1N5226CUR-1 with alternatives

Compare MSP1N5226CUR-1TR with alternatives