MV1N4685-1
vs
MX1N4685-1TR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
DO-7
Package Description
O-LALF-W2
DO-35, 2 PIN
Pin Count
2
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-204AA
DO-204AH
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.417 W
0.48 W
Qualification Status
Not Qualified
Not Qualified
Reference Standard
MIL-19500
MIL-19500
Reference Voltage-Nom
3.6 V
3.6 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
0.05 mA
0.05 mA
Base Number Matches
2
2
Additional Feature
METALLURGICAL BONDED
Forward Voltage-Max (VF)
1.1 V
Reverse Current-Max
7.5 µA
Reverse Test Voltage
2 V
Compare MV1N4685-1 with alternatives
Compare MX1N4685-1TR with alternatives