MV1N3047UR-1 vs MSP1N3047UR-1E3TR feature comparison

MV1N3047UR-1 Microsemi Corporation

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MSP1N3047UR-1E3TR Microsemi Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DO-213AB DO-213AB
Package Description O-LELF-R2 O-LELF-R2
Pin Count 2 2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Category CO2 Kg 8.7 8.7
Compliance Temperature Grade Military: -65C to +175C Military: -65C to +175C
Additional Feature METALLURGICALLY BONDED, HIGH RELIABILITY METALLURGICALLY BONDED, HIGH RELIABILITY
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-213AB DO-213AB
JESD-30 Code O-LELF-R2 O-LELF-R2
JESD-609 Code e0 e3
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1.25 W 1.25 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 130 V 130 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD MATTE TIN
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Tol-Max 20% 20%
Working Test Current 1.9 mA 1.9 mA
Base Number Matches 1 1
EU RoHS Version RoHS 2 (2011/65/EU)

Compare MV1N3047UR-1 with alternatives

Compare MSP1N3047UR-1E3TR with alternatives