MV1N3045BUR-1TR vs MX1N3045BUR-1E3TR feature comparison

MV1N3045BUR-1TR Microsemi Corporation

Buy Now Datasheet

MX1N3045BUR-1E3TR Microsemi Corporation

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DO-213AB DO-213AB
Package Description O-LELF-R2 O-LELF-R2
Pin Count 2 2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED, HIGH RELIABILITY METALLURGICALLY BONDED, HIGH RELIABILITY
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-213AB DO-213AB
JESD-30 Code O-LELF-R2 O-LELF-R2
JESD-609 Code e0 e3
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1.25 W 1.25 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 110 V 110 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD MATTE TIN
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Tol-Max 5% 5%
Working Test Current 2.3 mA 2.3 mA
Base Number Matches 1 1

Compare MV1N3045BUR-1TR with alternatives

Compare MX1N3045BUR-1E3TR with alternatives