MV1443/IG/DGAS
vs
MH89770S
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MICROSEMI CORP
|
MITEL SEMICONDUCTOR
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Carrier Type |
CEPT PCM-30/E-1
|
|
JESD-30 Code |
R-XDIP-T40
|
R-PDSO-G40
|
Number of Terminals |
40
|
40
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
|
Package Equivalence Code |
DIP40,.6
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
2
|
2
|
Part Package Code |
|
SOIC
|
Package Description |
|
,
|
Pin Count |
|
40
|
Number of Functions |
|
1
|
Supply Current-Max |
|
25 mA
|
Telecom IC Type |
|
FRAMER
|
|
|
|
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