MUR860
vs
MUR860-BP-HF
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
MICRO COMMERCIAL COMPONENTS CORP
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.5 V
|
1.5 V
|
| JESD-609 Code |
e0
|
e3
|
| Non-rep Pk Forward Current-Max |
100 A
|
125 A
|
| Number of Elements |
1
|
1
|
| Operating Temperature-Max |
175 °C
|
150 °C
|
| Output Current-Max |
8 A
|
8 A
|
| Rep Pk Reverse Voltage-Max |
600 V
|
600 V
|
| Reverse Recovery Time-Max |
0.06 µs
|
0.05 µs
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Matte Tin (Sn)
|
| Base Number Matches |
27
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.80
|
| Date Of Intro |
|
2016-09-14
|
| Application |
|
SUPER FAST RECOVERY
|
| Case Connection |
|
CATHODE
|
| Diode Element Material |
|
SILICON
|
| JEDEC-95 Code |
|
TO-220AC
|
| JESD-30 Code |
|
R-PSFM-T2
|
| Moisture Sensitivity Level |
|
1
|
| Number of Phases |
|
1
|
| Number of Terminals |
|
2
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Reverse Current-Max |
|
5 µA
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Position |
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
|
5
|
|
|
|
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