MUR840HC0G
vs
RHRP840
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
TAIWAN SEMICONDUCTOR CO LTD
|
HARRIS SEMICONDUCTOR
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Samacsys Manufacturer |
Taiwan Semiconductor
|
|
| Additional Feature |
HIGH RELIABILITY
|
FREEWHEELING DIODE
|
| Application |
EFFICIENCY
|
HYPERFAST SOFT RECOVERY
|
| Case Connection |
CATHODE
|
CATHODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.3 V
|
2.1 V
|
| JEDEC-95 Code |
TO-220AC
|
|
| JESD-30 Code |
R-PSFM-T2
|
R-PSFM-T2
|
| JESD-609 Code |
e3
|
e0
|
| Non-rep Pk Forward Current-Max |
100 A
|
100 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Operating Temperature-Min |
-55 °C
|
-65 °C
|
| Output Current-Max |
8 A
|
8 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Reference Standard |
AEC-Q101
|
|
| Rep Pk Reverse Voltage-Max |
400 V
|
400 V
|
| Reverse Current-Max |
5 µA
|
100 µA
|
| Reverse Recovery Time-Max |
0.05 µs
|
0.035 µs
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
|
| Base Number Matches |
1
|
4
|
| Rohs Code |
|
No
|
| Package Description |
|
R-PSFM-T2
|
| Power Dissipation-Max |
|
75 W
|
| Qualification Status |
|
Not Qualified
|
| Technology |
|
AVALANCHE
|
|
|
|
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