MUR1660
vs
MGR1605
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SANGDEST MICROELECTRONICS (NANJING) CO LTD
|
MICRO COMMERCIAL COMPONENTS
|
Package Description |
LEAD FREE, PLASTIC PACKAGE-3/2
|
TO-220AC, 2 PIN
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Additional Feature |
LOW LEAKAGE CURRENT
|
HIGH RELIABILITY
|
Application |
ULTRA FAST RECOVERY
|
GENERAL PURPOSE
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
1.7 V
|
1.1 V
|
JEDEC-95 Code |
TO-220AC
|
TO-220AC
|
JESD-30 Code |
R-PSFM-T2
|
R-PSFM-T2
|
Non-rep Pk Forward Current-Max |
250 A
|
250 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
|
Operating Temperature-Min |
-55 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Rep Pk Reverse Voltage-Max |
600 V
|
600 V
|
Reverse Current-Max |
5 µA
|
10 µA
|
Reverse Recovery Time-Max |
0.05 µs
|
|
Surface Mount |
NO
|
NO
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
SINGLE
|
SINGLE
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Base Number Matches |
9
|
1
|
Pbfree Code |
|
No
|
Part Package Code |
|
TO-220AC
|
Pin Count |
|
3
|
HTS Code |
|
8541.10.00.80
|
Case Connection |
|
CATHODE
|
JESD-609 Code |
|
e0
|
Output Current-Max |
|
16 A
|
Qualification Status |
|
Not Qualified
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare MGR1605 with alternatives