MUN2231T1
vs
PDTC123ET,215
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ONSEMI
NXP SEMICONDUCTORS
Part Package Code
SC-59
TO-236
Package Description
CASE 318D-04, SC-59, 3 PIN
PLASTIC PACKAGE-3
Pin Count
3
3
Manufacturer Package Code
CASE 318D-04
SOT23
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
Factory Lead Time
4 Weeks
Additional Feature
BUILT-IN BIAS RESISTOR RATIO IS 1
BUILT-IN BIAS RESISTOR RATIO IS 1
Collector Current-Max (IC)
0.1 A
0.1 A
Collector-Emitter Voltage-Max
50 V
50 V
Configuration
SINGLE WITH BUILT-IN RESISTOR
SINGLE WITH BUILT-IN RESISTOR
DC Current Gain-Min (hFE)
8
30
JESD-30 Code
R-PDSO-G3
R-PDSO-G3
JESD-609 Code
e0
e3
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Terminals
3
3
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
235
260
Polarity/Channel Type
NPN
NPN
Power Dissipation-Max (Abs)
0.338 W
0.25 W
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Finish
TIN LEAD
TIN
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Transistor Application
SWITCHING
SWITCHING
Transistor Element Material
SILICON
SILICON
Base Number Matches
5
2
HTS Code
8541.21.00.95
Collector-Base Capacitance-Max
3.5 pF
JEDEC-95 Code
TO-236AB
Operating Temperature-Max
150 °C
Power Dissipation Ambient-Max
0.25 W
Time@Peak Reflow Temperature-Max (s)
30
VCEsat-Max
0.3 V
Compare MUN2231T1 with alternatives
Compare PDTC123ET,215 with alternatives