MU9C8338-TFI
vs
LU3XS38FT-BA388
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
MUSIC SEMICONDUCTORS INC
AGERE SYSTEMS INC
Part Package Code
QFP
BGA
Package Description
QFP, QFP144,.87SQ,20
BGA,
Pin Count
144
388
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PQFP-G144
S-PBGA-B388
JESD-609 Code
e0
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
144
388
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
BGA
Package Equivalence Code
QFP144,.87SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max
0.09 mA
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Telecom IC Type
INTERFACE CIRCUIT
INTERFACE CIRCUIT
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
QUAD
BOTTOM
Base Number Matches
1
1
Length
35 mm
Seated Height-Max
2.54 mm
Width
35 mm
Compare MU9C8338-TFI with alternatives
Compare LU3XS38FT-BA388 with alternatives