MTP8P10 vs RFP8P10 feature comparison

MTP8P10 Freescale Semiconductor

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RFP8P10 General Electric Solid State

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS GENERAL ELECTRIC SOLID STATE
Package Description FLANGE MOUNT, R-PSFM-T3
Reach Compliance Code unknown unknown
Additional Feature LEADFORM OPTIONS ARE AVAILABLE
Case Connection DRAIN
Configuration Single
DS Breakdown Voltage-Min 100 V
Drain Current-Max (Abs) (ID) 8 A
Drain Current-Max (ID) 8 A
Drain-source On Resistance-Max 0.4 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss) 180 pF
JEDEC-95 Code TO-220AB
JESD-30 Code R-PSFM-T3
JESD-609 Code e0
Number of Elements 1
Number of Terminals 3
Operating Mode ENHANCEMENT MODE
Operating Temperature-Max 150 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style FLANGE MOUNT
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity/Channel Type P-CHANNEL
Power Dissipation Ambient-Max 75 W
Power Dissipation-Max (Abs) 75 W
Pulsed Drain Current-Max (IDM) 25 A
Qualification Status Not Qualified
Surface Mount NO
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Position SINGLE
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Transistor Application SWITCHING
Transistor Element Material SILICON
Turn-off Time-Max (toff) 350 ns
Turn-on Time-Max (ton) 230 ns
Base Number Matches 3 5
ECCN Code EAR99