MTP6N60
vs
SSP7N55
feature comparison
| Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
| Ihs Manufacturer |
SEMICONDUCTOR TECHNOLOGY INC
|
SAMSUNG SEMICONDUCTOR INC
|
| Package Description |
,
|
FLANGE MOUNT, R-PSFM-T3
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Base Number Matches |
6
|
1
|
| Part Package Code |
|
SFM
|
| Pin Count |
|
3
|
| Configuration |
|
SINGLE
|
| DS Breakdown Voltage-Min |
|
550 V
|
| Drain Current-Max (ID) |
|
7 A
|
| Drain-source On Resistance-Max |
|
1.2 Ω
|
| FET Technology |
|
METAL-OXIDE SEMICONDUCTOR
|
| JEDEC-95 Code |
|
TO-220AB
|
| JESD-30 Code |
|
R-PSFM-T3
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
3
|
| Operating Mode |
|
ENHANCEMENT MODE
|
| Operating Temperature-Max |
|
150 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
FLANGE MOUNT
|
| Polarity/Channel Type |
|
N-CHANNEL
|
| Power Dissipation-Max (Abs) |
|
140 W
|
| Qualification Status |
|
Not Qualified
|
| Surface Mount |
|
NO
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Position |
|
SINGLE
|
| Transistor Element Material |
|
SILICON
|
|
|
|
Compare SSP7N55 with alternatives