MTFC128GAPALPH-AAT
vs
MTFC128GAPALNA-AIT
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
MICRON TECHNOLOGY INC
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Date Of Intro |
2020-03-31
|
2018-11-26
|
Samacsys Manufacturer |
Micron
|
Micron
|
Base Number Matches |
1
|
2
|
Rohs Code |
|
Yes
|
Package Description |
|
TBGA-100
|
JESD-30 Code |
|
R-PBGA-B100
|
JESD-609 Code |
|
e1
|
Length |
|
18 mm
|
Memory Density |
|
1099511627776 bit
|
Memory IC Type |
|
FLASH
|
Memory Width |
|
8
|
Number of Functions |
|
1
|
Number of Terminals |
|
100
|
Number of Words |
|
137438953472 words
|
Number of Words Code |
|
128000000000
|
Operating Mode |
|
SYNCHRONOUS
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
|
128GX8
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
TBGA
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
GRID ARRAY, THIN PROFILE
|
Parallel/Serial |
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
|
260
|
Programming Voltage |
|
2.7 V
|
Seated Height-Max |
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
|
3.6 V
|
Supply Voltage-Min (Vsup) |
|
2.7 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
TIN SILVER COPPER
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
1 mm
|
Terminal Position |
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
14 mm
|
|
|
|
Compare MTFC128GAPALPH-AAT with alternatives
Compare MTFC128GAPALNA-AIT with alternatives