MT9172AN1
vs
MT8972BP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICROSEMI CORP
ZARLINK SEMICONDUCTOR INC
Part Package Code
SSOP
Package Description
5.30 MM WIDTH, LEAD FREE, MO-150AG, SSOP-24
PLASTIC, LCC-28
Pin Count
24
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Microsemi Corporation
JESD-30 Code
R-PDSO-G24
S-PQCC-J28
JESD-609 Code
e3
e0
Length
8.2 mm
11.5062 mm
Number of Functions
1
1
Number of Terminals
24
28
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
QCCJ
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, SHRINK PITCH
CHIP CARRIER
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
4.57 mm
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Telecom IC Type
DIGITAL SLIC
DIGITAL SLIC
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
GULL WING
J BEND
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
QUAD
Width
5.3 mm
11.5062 mm
Base Number Matches
3
2
Data Rate
160 Mbps
ISDN Access Rate
BASIC
Output High Voltage-Min
2.4 V
Output Low Current-Max
0.005 A
Output Low Voltage-Max
0.4 V
Package Equivalence Code
LDCC28,.5SQ
Peak Reflow Temperature (Cel)
260
Reference Point
S
Compare MT9172AN1 with alternatives
Compare MT8972BP with alternatives