MT9171AE
vs
MT9171AN
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
ZARLINK SEMICONDUCTOR INC
|
MICROSEMI CORP
|
| Package Description |
DIP, DIP22,.4
|
5.30 MM WIDTH, MO-150AG, SSOP-24
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Data Rate |
144 Mbps
|
144 Mbps
|
| ISDN Access Rate |
BASIC
|
BASIC
|
| JESD-30 Code |
R-PDIP-T22
|
R-PDSO-G24
|
| JESD-609 Code |
e0
|
e0
|
| Length |
27.555 mm
|
8.2 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
22
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output High Voltage-Min |
2.4 V
|
2.4 V
|
| Output Low Voltage-Max |
0.4 V
|
0.4 V
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SSOP
|
| Package Equivalence Code |
DIP22,.4
|
SSOP24,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Point |
S
|
S
|
| Seated Height-Max |
5.33 mm
|
2 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
DIGITAL SLIC
|
DIGITAL SLIC
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
10.16 mm
|
5.3 mm
|
| Base Number Matches |
2
|
4
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
SSOP
|
| Pin Count |
|
24
|
|
|
|
Compare MT9171AE with alternatives
Compare MT9171AN with alternatives