MT90869AG2
vs
MT90869AG2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
27 X 27 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, MS-034BAL-2, BGA-272
27 X 27 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, MS-034BAL-2, BGA-272
Reach Compliance Code
compliant
compliant
JESD-30 Code
S-PBGA-B272
S-PBGA-B272
JESD-609 Code
e1
e1
Length
27 mm
27 mm
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
272
272
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA272,20X20,50
BGA272,20X20,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.32 mm
2.32 mm
Supply Current-Max
200 mA
200 mA
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Telecom IC Type
DIGITAL TIME SWITCH
DIGITAL TIME SWITCH
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
Base Number Matches
1
1
Pbfree Code
Part Package Code
BGA
Pin Count
272
HTS Code
8542.39.00.01
Samacsys Manufacturer
Microsemi Corporation
Compare MT90869AG2 with alternatives
Compare MT90869AG2 with alternatives