MT9074APR1
vs
MT9075BPR1
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ZARLINK SEMICONDUCTOR INC
|
Package Description |
LEAD FREE, PLASTIC, MS-018AE, LCC-68
|
LEAD FREE, PLASTIC, MS-018AE, LCC-68
|
Reach Compliance Code |
compliant
|
compliant
|
Carrier Type |
CEPT PCM-30/E-1
|
|
Carrier Type (2) |
T-1(DS1)
|
|
JESD-30 Code |
S-PQCC-J68
|
S-PQCC-J68
|
JESD-609 Code |
e3
|
e3
|
Length |
24.23 mm
|
24.23 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
68
|
68
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC68,1.0SQ
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Supply Current-Max |
200 mA
|
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
FRAMER
|
FRAMER
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
Matte Tin (Sn)
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
24.23 mm
|
24.23 mm
|
Base Number Matches |
3
|
3
|
HTS Code |
|
8542.39.00.01
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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