MT8LSDT864HIY-133XX
vs
HYS64V8000GD-8
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
SIEMENS A G
|
Part Package Code |
SODIMM
|
DIMM
|
Package Description |
LEAD FREE, SODIMM-144
|
,
|
Pin Count |
144
|
144
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.28
|
8542.32.00.28
|
Access Mode |
DUAL BANK PAGE BURST
|
SINGLE BANK PAGE BURST
|
Access Time-Max |
5.4 ns
|
7 ns
|
Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
JESD-30 Code |
R-XZMA-N144
|
R-XDMA-N144
|
JESD-609 Code |
e4
|
|
Length |
67.585 mm
|
|
Memory Density |
536870912 bit
|
536870912 bit
|
Memory IC Type |
SYNCHRONOUS DRAM MODULE
|
SYNCHRONOUS DRAM MODULE
|
Memory Width |
64
|
64
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
144
|
144
|
Number of Words |
8388608 words
|
8388608 words
|
Number of Words Code |
8000000
|
8000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
8MX64
|
8MX64
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
DIMM
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.8 mm
|
|
Self Refresh |
YES
|
YES
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
GOLD
|
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Position |
ZIG-ZAG
|
DUAL
|
Width |
31.75 mm
|
|
Base Number Matches |
1
|
2
|
Output Characteristics |
|
3-STATE
|
Refresh Cycles |
|
4096
|
|
|
|
Compare MT8LSDT864HIY-133XX with alternatives
Compare HYS64V8000GD-8 with alternatives