MT8KTF25664AZ-1G4XX vs W1D256M72R8B-5AE-PA2 feature comparison

MT8KTF25664AZ-1G4XX Micron Technology Inc

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W1D256M72R8B-5AE-PA2 AMD Xilinx

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICRON TECHNOLOGY INC XILINX INC
Part Package Code DIMM DIMM
Package Description HALOGEN FREE, MO-269R/CA, UDIMM-240 DIMM,
Pin Count 240 240
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.36
Access Mode SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-XDMA-N240 R-XDMA-N240
JESD-609 Code e4 e4
Length 133.35 mm 133.35 mm
Memory Density 17179869184 bit 2147483648 bit
Memory IC Type DDR3 DRAM DDR DRAM MODULE
Memory Width 64 8
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 240 240
Number of Words 268435456 words 268435456 words
Number of Words Code 256000000 256000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 55 °C
Operating Temperature-Min
Organization 256MX64 256MX8
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIMM DIMM
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Seated Height-Max 30.5 mm 2.7 mm
Self Refresh YES
Supply Voltage-Max (Vsup) 1.45 V 1.9 V
Supply Voltage-Min (Vsup) 1.283 V 1.7 V
Supply Voltage-Nom (Vsup) 1.35 V 1.8 V
Surface Mount NO NO
Technology CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish GOLD GOLD
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Access Time-Max 0.5 ns
Qualification Status Not Qualified
Width 25.4 mm

Compare MT8KTF25664AZ-1G4XX with alternatives

Compare W1D256M72R8B-5AE-PA2 with alternatives