MT8HTF3264AIY-667XX
vs
HYS64T32001HU-3S-A
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
INFINEON TECHNOLOGIES AG
|
Part Package Code |
DIMM
|
DIMM
|
Package Description |
DIMM,
|
DIMM,
|
Pin Count |
240
|
240
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.36
|
8542.32.00.36
|
Access Mode |
SINGLE BANK PAGE BURST
|
SINGLE BANK PAGE BURST
|
Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
JESD-30 Code |
R-XDMA-N240
|
R-XDMA-N240
|
JESD-609 Code |
e4
|
|
Length |
133.35 mm
|
|
Memory Density |
2147483648 bit
|
2147483648 bit
|
Memory IC Type |
DDR DRAM MODULE
|
DDR DRAM MODULE
|
Memory Width |
64
|
64
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
240
|
240
|
Number of Words |
33554432 words
|
33554432 words
|
Number of Words Code |
32000000
|
32000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
65 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
32MX64
|
32MX64
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
DIMM
|
DIMM
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.7 mm
|
|
Self Refresh |
YES
|
YES
|
Supply Voltage-Max (Vsup) |
1.9 V
|
1.9 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
GOLD
|
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Position |
DUAL
|
DUAL
|
Width |
30.175 mm
|
|
Base Number Matches |
1
|
2
|
Access Time-Max |
|
0.45 ns
|
|
|
|
Compare MT8HTF3264AIY-667XX with alternatives
Compare HYS64T32001HU-3S-A with alternatives