MT89L86AP1 vs MT89L86ANR feature comparison

MT89L86AP1 Microsemi Corporation

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MT89L86ANR Zarlink Semiconductor Inc

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP ZARLINK SEMICONDUCTOR INC
Part Package Code LPCC
Package Description LEAD FREE, PLASTIC, MS-018AC, LCC-44 SSOP,
Pin Count 44
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQCC-J44 R-PDSO-G48
JESD-609 Code e3 e0
Length 16.585 mm 16 mm
Number of Functions 1 1
Number of Terminals 44 48
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ SSOP
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER SMALL OUTLINE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 2.79 mm
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Telecom IC Type DIGITAL TIME SWITCH DIGITAL TIME SWITCH
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 0.635 mm
Terminal Position QUAD DUAL
Width 16.585 mm 7.5 mm
Base Number Matches 3 2
Moisture Sensitivity Level 3

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