MT8977APR1
vs
DS2141AQN+
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ZARLINK SEMICONDUCTOR INC
MAXIM INTEGRATED PRODUCTS INC
Part Package Code
LPCC
LCC
Package Description
QCCJ,
QCCJ,
Pin Count
44
44
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PQCC-J44
S-PQCC-J44
JESD-609 Code
e3
e3
Length
16.585 mm
16.585 mm
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
44
44
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.57 mm
4.57 mm
Supply Current-Max
10 mA
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Telecom IC Type
FRAMER
FRAMER
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
16.585 mm
16.585 mm
Base Number Matches
1
2
Time@Peak Reflow Temperature-Max (s)
30
Compare MT8977APR1 with alternatives
Compare DS2141AQN+ with alternatives