MT8977AP1 vs MT8979AP1 feature comparison

MT8977AP1 Microsemi Corporation

Buy Now Datasheet

MT8979AP1 Microsemi Corporation

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ZARLINK SEMICONDUCTOR INC MICROSEMI CORP
Part Package Code LPCC LPCC
Package Description QCCJ, LEAD FREE, PLASTIC, MS-018AC, LCC-44
Pin Count 44 44
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQCC-J44 S-PQCC-J44
JESD-609 Code e3 e3
Length 16.585 mm 16.585 mm
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 44 44
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 4.57 mm
Supply Current-Max 10 mA 16 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Telecom IC Type FRAMER FRAMER
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 16.585 mm 16.585 mm
Base Number Matches 2 2

Compare MT8977AP1 with alternatives

Compare MT8979AP1 with alternatives