MT8976AE vs MT8979AE feature comparison

MT8976AE Zarlink Semiconductor Inc

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MT8979AE Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ZARLINK SEMICONDUCTOR INC MITEL SEMICONDUCTOR
Package Description PLASTIC, MS-011AB, DIP-28 DIP-28
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T28 R-PDIP-T28
JESD-609 Code e0 e0
Length 37.4 mm 37.4 mm
Number of Functions 1 1
Number of Terminals 28 28
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP28,.6 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 6.35 mm 6.35 mm
Supply Current-Max 10 mA 16 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Telecom IC Type FRAMER FRAMER
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 2 2
Pbfree Code No
Part Package Code DIP
Pin Count 28
Carrier Type CEPT PCM-30/E-1

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