MT6V16M16F2-4C
vs
MT47H16M16BG-5ELIT:B
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
FBGA-84
TFBGA, BGA84,9X15,32
Pin Count
84
84
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.24
8542.32.00.24
Access Mode
BLOCK ORIENTED PROTOCOL
FOUR BANK PAGE BURST
Additional Feature
SELF CONTAINED REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PBGA-B84
R-PBGA-B84
JESD-609 Code
e1
e1
Memory Density
268435456 bit
268435456 bit
Memory IC Type
RAMBUS DRAM
DDR2 DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
84
84
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Organization
16MX16
16MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Self Refresh
YES
YES
Supply Voltage-Nom (Vsup)
2.5 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
1
1
Rohs Code
Access Time-Max
0.6 ns
Clock Frequency-Max (fCLK)
200 MHz
I/O Type
COMMON
Interleaved Burst Length
4,8
Length
14 mm
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Output Characteristics
3-STATE
Package Equivalence Code
BGA84,9X15,32
Refresh Cycles
8192
Seated Height-Max
1.2 mm
Sequential Burst Length
4,8
Standby Current-Max
0.005 A
Supply Current-Max
0.29 mA
Supply Voltage-Max (Vsup)
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
Temperature Grade
INDUSTRIAL
Terminal Pitch
0.8 mm
Width
8 mm
Compare MT6V16M16F2-4C with alternatives
Compare MT47H16M16BG-5ELIT:B with alternatives