MT6V16M16F2-3C vs HYB18T256160BF-3.7 feature comparison

MT6V16M16F2-3C Micron Technology Inc

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HYB18T256160BF-3.7 Qimonda AG

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC QIMONDA AG
Part Package Code BGA BGA
Package Description FBGA-84 TFBGA, BGA84,9X15,32
Pin Count 84 84
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.24 8542.32.00.24
Access Mode BLOCK ORIENTED PROTOCOL FOUR BANK PAGE BURST
Additional Feature SELF CONTAINED REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B84 R-PBGA-B84
JESD-609 Code e1
Memory Density 268435456 bit 268435456 bit
Memory IC Type RAMBUS DRAM DDR2 DRAM
Memory Width 16 16
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 84 84
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Organization 16MX16 16MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Self Refresh YES YES
Supply Voltage-Nom (Vsup) 2.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Base Number Matches 1 1
Rohs Code Yes
Access Time-Max 0.5 ns
Clock Frequency-Max (fCLK) 266 MHz
I/O Type COMMON
Interleaved Burst Length 4,8
Length 12.5 mm
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Operating Temperature-Min
Output Characteristics 3-STATE
Package Equivalence Code BGA84,9X15,32
Refresh Cycles 8192
Seated Height-Max 1.2 mm
Sequential Burst Length 4,8
Standby Current-Max 0.033 A
Supply Current-Max 0.135 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Temperature Grade COMMERCIAL
Terminal Pitch 0.8 mm
Width 10 mm

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Compare HYB18T256160BF-3.7 with alternatives