MT600
vs
LN15XB60H
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
SHINDENGEN ELECTRIC MANUFACTURING CO LTD
|
| Package Description |
HERMETIC SEALED PACKAGE-4
|
R-PSFM-T4
|
| Pin Count |
4
|
4
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Samacsys Manufacturer |
Microsemi Corporation
|
|
| Additional Feature |
LEAKAGE CURRENT IS NOT AT 25 DEG C
|
LOW NOISE
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
BRIDGE, 4 ELEMENTS
|
BRIDGE, 4 ELEMENTS
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
BRIDGE RECTIFIER DIODE
|
BRIDGE RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.2 V
|
1.05 V
|
| JESD-30 Code |
O-MUPF-D4
|
R-PSFM-T4
|
| JESD-609 Code |
e0
|
|
| Non-rep Pk Forward Current-Max |
200 A
|
290 A
|
| Number of Elements |
4
|
4
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
4
|
4
|
| Operating Temperature-Max |
200 °C
|
150 °C
|
| Operating Temperature-Min |
-65 °C
|
|
| Output Current-Max |
25 A
|
3.3 A
|
| Package Body Material |
METAL
|
PLASTIC/EPOXY
|
| Package Shape |
ROUND
|
RECTANGULAR
|
| Package Style |
PRESS FIT
|
FLANGE MOUNT
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
600 V
|
600 V
|
| Reverse Current-Max |
0.001 µA
|
10 µA
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
SOLDER LUG
|
THROUGH-HOLE
|
| Terminal Position |
UPPER
|
SINGLE
|
| Base Number Matches |
3
|
3
|
| Reverse Recovery Time-Max |
|
5 µs
|
| Reverse Test Voltage |
|
600 V
|
|
|
|
Compare MT600 with alternatives
Compare LN15XB60H with alternatives