MT5VDDT1672HIG-335XX vs MT9VDDT1672HG-26AXX feature comparison

MT5VDDT1672HIG-335XX Micron Technology Inc

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MT9VDDT1672HG-26AXX Micron Technology Inc

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Part Package Code SODIMM SODIMM
Package Description DIMM, DIMM,
Pin Count 200 200
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.36 8542.32.00.36
Access Mode FOUR BANK PAGE BURST SINGLE BANK PAGE BURST
Access Time-Max 0.9 ns 0.75 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-XZMA-N200 R-XZMA-N200
Memory Density 1207959552 bit 1207959552 bit
Memory IC Type DDR DRAM MODULE DDR DRAM MODULE
Memory Width 72 72
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 200 200
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 16MX72 16MX72
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIMM DIMM
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Cel) 235
Qualification Status Not Qualified Not Qualified
Self Refresh YES YES
Supply Voltage-Max (Vsup) 2.7 V 2.7 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Position ZIG-ZAG ZIG-ZAG
Time@Peak Reflow Temperature-Max (s) 30
Base Number Matches 1 1
JESD-609 Code e0
Length 67.585 mm
Seated Height-Max 3.8 mm
Terminal Finish TIN LEAD
Width 35.56 mm

Compare MT5VDDT1672HIG-335XX with alternatives

Compare MT9VDDT1672HG-26AXX with alternatives