MT5C6404C-55/883C
vs
HM365788K-9:D
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MICRON TECHNOLOGY INC
TEMIC SEMICONDUCTORS
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Access Time-Max
55 ns
35 ns
I/O Type
COMMON
JESD-30 Code
R-XDIP-T22
R-PDIP-T22
JESD-609 Code
e0
Memory Density
65536 bit
65536 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
4
4
Number of Terminals
22
22
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
16KX4
16KX4
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP22,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Standby Current-Max
0.005 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.09 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
2
Number of Functions
1
Number of Ports
1
Output Enable
NO
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