MT5C2568ECW-100/IT
vs
MT5C2568CW-100/XT
feature comparison
| Pbfree Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROSS COMPONENTS
|
MICROSS COMPONENTS
|
| Part Package Code |
QFJ
|
DIP
|
| Package Description |
,
|
,
|
| Pin Count |
32
|
28
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
100 ns
|
100 ns
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-CQCC-N32
|
R-CDIP-T28
|
| Length |
13.97 mm
|
37.846 mm
|
| Memory Density |
262144 bit
|
262144 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
32
|
28
|
| Number of Words |
32768 words
|
32768 words
|
| Number of Words Code |
32000
|
32000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Organization |
32KX8
|
32KX8
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Enable |
YES
|
YES
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCN
|
DIP
|
| Package Equivalence Code |
LCC32,.45X.55
|
DIP28,.6
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Seated Height-Max |
3.048 mm
|
5.8928 mm
|
| Standby Voltage-Min |
2 V
|
2 V
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
11.43 mm
|
15.24 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MT5C2568ECW-100/IT with alternatives
Compare MT5C2568CW-100/XT with alternatives