MT5C2565EC-25/IT
vs
WS128K32-45HSME
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROSS COMPONENTS
|
WHITE ELECTRONIC DESIGNS CORP
|
Part Package Code |
QLCC
|
|
Package Description |
CERAMIC, LCC-28
|
1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
|
Pin Count |
28
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
3A001.A.2.C
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
25 ns
|
45 ns
|
JESD-30 Code |
R-CQCC-N28
|
S-CPGA-P66
|
Length |
13.97 mm
|
30.1 mm
|
Memory Density |
262144 bit
|
4194304 bit
|
Memory IC Type |
STANDARD SRAM
|
SRAM MODULE
|
Memory Width |
4
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
66
|
Number of Words |
65536 words
|
524288 words
|
Number of Words Code |
64000
|
512000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Organization |
64KX4
|
512KX8
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QCCN
|
PGA
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
CHIP CARRIER
|
GRID ARRAY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Seated Height-Max |
3.048 mm
|
6.22 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Form |
NO LEAD
|
PIN/PEG
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
PERPENDICULAR
|
Width |
8.89 mm
|
30.1 mm
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
Additional Feature |
|
USER CONFIGURABLE AS 128K X 32
|
Alternate Memory Width |
|
16
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Qualification Status |
|
Not Qualified
|
Screening Level |
|
MIL-STD-883
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare MT5C2565EC-25/IT with alternatives
Compare WS128K32-45HSME with alternatives