MT5C2565C-25L/883C vs MT5C2565C-25LAT feature comparison

MT5C2565C-25L/883C Micross Components

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MT5C2565C-25LAT Micron Technology Inc

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROSS COMPONENTS MICRON TECHNOLOGY INC
Part Package Code DIP
Package Description 0.300 INCH, CERAMIC, DIP-28
Pin Count 28
Reach Compliance Code compliant not_compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
JESD-30 Code R-CDIP-T28 R-XDIP-T28
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 4 4
Number of Functions 1
Number of Terminals 28 28
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Organization 64KX4 64KX4
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 1
Rohs Code No
I/O Type COMMON
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code DIP28,.3
Standby Current-Max 0.0003 A
Standby Voltage-Min 2 V
Supply Current-Max 0.11 mA
Terminal Finish Tin/Lead (Sn/Pb)

Compare MT5C2565C-25L/883C with alternatives

Compare MT5C2565C-25LAT with alternatives