MT5C2561C-35L/IT vs SMJ61CD256-35JDM feature comparison

MT5C2561C-35L/IT Micross Components

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SMJ61CD256-35JDM Texas Instruments

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROSS COMPONENTS TEXAS INSTRUMENTS INC
Part Package Code DIP
Package Description 0.300 INCH, CERAMIC, DIP-24 DIP, DIP24,.6
Pin Count 24
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 35 ns
JESD-30 Code R-CDIP-T24 R-CDIP-T24
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 1 1
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 256KX1 256KX1
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 1
Rohs Code No
Additional Feature AUTOMATIC POWER-DOWN
I/O Type SEPARATE
Number of Ports 1
Output Characteristics 3-STATE
Output Enable NO
Package Equivalence Code DIP24,.6
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Screening Level 38535Q/M;38534H;883B
Supply Current-Max 0.12 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MT5C2561C-35L/IT with alternatives

Compare SMJ61CD256-35JDM with alternatives