MT5C2561C-35L/IT
vs
CMDP-65697L-35:D
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROSS COMPONENTS
|
TEMIC SEMICONDUCTORS
|
| Part Package Code |
DIP
|
|
| Package Description |
0.300 INCH, CERAMIC, DIP-24
|
|
| Pin Count |
24
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.41
|
|
| Access Time-Max |
35 ns
|
35 ns
|
| JESD-30 Code |
R-CDIP-T24
|
S-CQFP-F28
|
| Memory Density |
262144 bit
|
262144 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
28
|
| Number of Words |
262144 words
|
262144 words
|
| Number of Words Code |
256000
|
256000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
256KX1
|
256KX1
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DFP
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
FLATPACK
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
THROUGH-HOLE
|
FLAT
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
1
|
| Number of Ports |
|
1
|
| Output Characteristics |
|
3-STATE
|
| Output Enable |
|
NO
|
| Qualification Status |
|
Not Qualified
|
| Standby Voltage-Min |
|
2 V
|
|
|
|
Compare MT5C2561C-35L/IT with alternatives
Compare CMDP-65697L-35:D with alternatives