MT5C2561C-12P/883C
vs
CY7C197D-12PXC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROSS COMPONENTS
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
DIP,
0.300 INCH, LEAD FREE, DIP-24
Pin Count
24
24
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
12 ns
12 ns
JESD-30 Code
R-CDIP-T24
R-PDIP-T24
JESD-609 Code
e0
e4
Length
30.48 mm
31.75 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
1
1
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
256KX1
256KX1
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.81 mm
4.826 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
NICKEL PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
I/O Type
SEPARATE
Moisture Sensitivity Level
1
Output Characteristics
3-STATE
Package Equivalence Code
DIP24,.3
Peak Reflow Temperature (Cel)
260
Standby Current-Max
0.003 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.05 mA
Time@Peak Reflow Temperature-Max (s)
20
Compare MT5C2561C-12P/883C with alternatives
Compare CY7C197D-12PXC with alternatives