MT5C1008CW-55L/IT
vs
EDI88130LPS55CB
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICROSS COMPONENTS
|
WHITE ELECTRONIC DESIGNS CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP32,.6
|
0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32
|
| Pin Count |
32
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.41
|
|
| Access Time-Max |
45 ns
|
55 ns
|
| Additional Feature |
TTL COMPATIBLE INPUTS/OUTPUTS, 2V DATA RETENTION, BATTERY BACKUP, LOW POWER STANDBY
|
BATTERY BACKUP OPERATION
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-CDIP-T32
|
R-CDIP-T32
|
| JESD-609 Code |
e0
|
|
| Length |
40.64 mm
|
40.64 mm
|
| Memory Density |
1048576 bit
|
1048576 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Number of Words |
131072 words
|
131072 words
|
| Number of Words Code |
128000
|
128000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Organization |
128KX8
|
128KX8
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP32,.6
|
DIP32,.6
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.34 mm
|
3.937 mm
|
| Standby Current-Max |
0.001 A
|
0.002 A
|
| Standby Voltage-Min |
2 V
|
2 V
|
| Supply Current-Max |
0.115 mA
|
0.2 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
15.24 mm
|
| Base Number Matches |
1
|
5
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Screening Level |
|
MIL-STD-883
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
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