MT58V512V32DF-10
vs
GS816132D-150
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
GSI TECHNOLOGY
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
13 X 15 MM, FBGA-165
|
BGA, BGA165,11X15,40
|
| Pin Count |
165
|
165
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
5 ns
|
7.5 ns
|
| Additional Feature |
PIPELINED ARCHITECTURE
|
FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
|
| Clock Frequency-Max (fCLK) |
100 MHz
|
150 MHz
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-PBGA-B165
|
R-PBGA-B165
|
| JESD-609 Code |
e0
|
e0
|
| Length |
15 mm
|
15 mm
|
| Memory Density |
16777216 bit
|
16777216 bit
|
| Memory IC Type |
CACHE SRAM
|
CACHE SRAM
|
| Memory Width |
32
|
32
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
165
|
165
|
| Number of Words |
524288 words
|
524288 words
|
| Number of Words Code |
512000
|
512000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
512KX32
|
512KX32
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TBGA
|
BGA
|
| Package Equivalence Code |
BGA165,11X15,40
|
BGA165,11X15,40
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE
|
GRID ARRAY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
|
| Standby Current-Max |
0.03 A
|
|
| Standby Voltage-Min |
2.38 V
|
2.3 V
|
| Supply Current-Max |
0.21 mA
|
|
| Supply Voltage-Max (Vsup) |
2.625 V
|
2.7 V
|
| Supply Voltage-Min (Vsup) |
2.375 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
13 mm
|
13 mm
|
| Base Number Matches |
2
|
1
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
235
|
|
|
|
Compare MT58V512V32DF-10 with alternatives
Compare GS816132D-150 with alternatives