MT58LC64K18M1EJ-12L
vs
MCM67M618BFN12
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
LCC
Package Description
19.10 X 19.10 MM, PLASTIC, LCC-52
QCCJ, LDCC52,.8SQ
Pin Count
52
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
12 ns
12 ns
Additional Feature
LINEAR BURST
I/O Type
COMMON
COMMON
JESD-30 Code
S-PQCC-J52
S-PQCC-J52
JESD-609 Code
e0
e0
Length
19.1262 mm
Memory Density
1179648 bit
1179648 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
18
18
Number of Functions
1
Number of Ports
1
Number of Terminals
52
52
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
64KX18
64KX18
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC52,.8SQ
LDCC52,.8SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.57 mm
Standby Voltage-Min
2 V
4.75 V
Supply Current-Max
0.2 mA
0.25 mA
Supply Voltage-Max (Vsup)
3.465 V
Supply Voltage-Min (Vsup)
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
19.1262 mm
Base Number Matches
1
3
Power Supplies
5 V
Standby Current-Max
0.095 A
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