MT58LC128K36C5LG-10TR
vs
CY7C1394V18-200BZC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
QFP
BGA
Package Description
LQFP,
13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
Pin Count
100
165
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
5 ns
0.38 ns
JESD-30 Code
R-PQFP-G100
R-PBGA-B165
JESD-609 Code
e0
e0
Length
20 mm
15 mm
Memory Density
4718592 bit
18874368 bit
Memory IC Type
CACHE SRAM
DDR SRAM
Memory Width
36
36
Number of Functions
1
1
Number of Ports
1
Number of Terminals
100
165
Number of Words
131072 words
524288 words
Number of Words Code
128000
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
128KX36
512KX36
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
TBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
GRID ARRAY, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
1.9 V
Supply Voltage-Min (Vsup)
3.135 V
1.7 V
Supply Voltage-Nom (Vsup)
3.3 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
BALL
Terminal Pitch
0.65 mm
1 mm
Terminal Position
QUAD
BOTTOM
Width
14 mm
13 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Additional Feature
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
200 MHz
I/O Type
SEPARATE
Moisture Sensitivity Level
3
Package Equivalence Code
BGA165,11X15,40
Peak Reflow Temperature (Cel)
220
Standby Voltage-Min
1.7 V
Compare MT58LC128K36C5LG-10TR with alternatives
Compare CY7C1394V18-200BZC with alternatives