MT58LC128K18D9LG-10 vs KM718V789T-10 feature comparison

MT58LC128K18D9LG-10 Micron Technology Inc

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KM718V789T-10 Samsung Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC SAMSUNG SEMICONDUCTOR INC
Part Package Code QFP QFP
Package Description PLASTIC, MS-026, TQFP-100 LQFP, QFP100,.63X.87
Pin Count 100 100
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 5 ns 5 ns
Clock Frequency-Max (fCLK) 100 MHz 100 MHz
I/O Type COMMON COMMON
JESD-30 Code R-PQFP-G100 R-PQFP-G100
JESD-609 Code e0 e0
Length 20 mm 20 mm
Memory Density 2359296 bit 2359296 bit
Memory IC Type CACHE SRAM CACHE SRAM
Memory Width 9 18
Number of Functions 1 1
Number of Terminals 100 100
Number of Words 262144 words 131072 words
Number of Words Code 256000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX9 128KX18
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Equivalence Code QFP100,.63X.87 QFP100,.63X.87
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Standby Current-Max 0.01 A 0.01 A
Standby Voltage-Min 3.14 V 3.14 V
Supply Current-Max 0.25 mA 0.32 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3.135 V 3.13 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Width 14 mm 14 mm
Base Number Matches 1 1
Additional Feature LINEAR OR INTERLEAVED BURST