MT58L512L18PS-7.5IT
vs
AS7C33512PFD18A2-166TQC
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
ALLIANCE SEMICONDUCTOR CORP
|
Part Package Code |
QFP
|
QFP
|
Package Description |
LQFP,
|
LQFP,
|
Pin Count |
100
|
100
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
4 ns
|
4 ns
|
Additional Feature |
AUTOMATIC POWER DOWN; SELF-TIMED WRITE CYCLE; INDIVIDUAL BYTE WRITE
|
FLOW-THROUGH OR PIPELINED ARCHITECTURE
|
JESD-30 Code |
R-PQFP-G100
|
R-PQFP-G100
|
Length |
20 mm
|
20 mm
|
Memory Density |
9437184 bit
|
9437184 bit
|
Memory IC Type |
CACHE SRAM
|
STANDARD SRAM
|
Memory Width |
18
|
18
|
Number of Functions |
1
|
1
|
Number of Terminals |
100
|
100
|
Number of Words |
524288 words
|
524288 words
|
Number of Words Code |
512000
|
512000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
512KX18
|
512KX18
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LQFP
|
LQFP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK, LOW PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.6 mm
|
1.6 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.465 V
|
Supply Voltage-Min (Vsup) |
3.135 V
|
3.135 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
14 mm
|
14 mm
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare MT58L512L18PS-7.5IT with alternatives
Compare AS7C33512PFD18A2-166TQC with alternatives