MT58L256V36PT-6.6 vs MT58L256V36PT-7.5 feature comparison

MT58L256V36PT-6.6 Micron Technology Inc

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MT58L256V36PT-7.5 Micron Technology Inc

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Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Part Package Code QFP QFP
Package Description MS-026, TQFP-100 PLASTIC, TQFP-100
Pin Count 100 100
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3.8 ns 4 ns
Additional Feature AUTOMATIC POWER DOWN; SELF-TIMED WRITE CYCLE; INDIVIDUAL BYTE WRITE PIPELINED ARCHITECTURE
I/O Type COMMON COMMON
JESD-30 Code R-PQFP-G100 R-PQFP-G100
JESD-609 Code e0 e0
Length 20 mm 20 mm
Memory Density 9437184 bit 9437184 bit
Memory IC Type STANDARD SRAM CACHE SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 100 100
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX36 256KX36
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Equivalence Code QFP100,.63X.87 QFP100,.63X.87
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Standby Current-Max 0.01 A 0.01 A
Standby Voltage-Min 3.13 V 3.13 V
Supply Current-Max 0.4 mA 0.325 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Width 14 mm 14 mm
Base Number Matches 2 3
Factory Lead Time 4 Weeks

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