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MT58L256L32DS-6IT vs MT58L256L32DS-6IT feature comparison

MT58L256L32DS-6IT Micron Technology Inc

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MT58L256L32DS-6IT Cypress Semiconductor

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC CYPRESS SEMICONDUCTOR CORP
Part Package Code QFP QFP
Package Description LQFP, LQFP,
Pin Count 100 100
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3.5 ns 3.5 ns
JESD-30 Code R-PQFP-G100 R-PQFP-G100
Length 20 mm 20 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type CACHE SRAM CACHE SRAM
Memory Width 32 32
Number of Functions 1 1
Number of Terminals 100 100
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256KX32 256KX32
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Width 14 mm 14 mm
Base Number Matches 1 1
Rohs Code No
JESD-609 Code e0
Moisture Sensitivity Level 3
Terminal Finish TIN LEAD
Memory » SRAMs
Memory » SRAMs

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